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Semicon Taiwan kicks off, MOEA showcases 52 innovations

Semicon Taiwan kicks off, MOEA showcases 52 innovations

2023-09-07

Semicon Taiwan kicked off in Taipei on Wednesday, featuring the latest in semiconductor technologies. The Ministry of Economic Affairs is showing 52 “forward-looking” innovations at a themed pavilion. One highlight is an award-winning hybrid atomic layer deposition technology for sub-2-nanometer processes. Another is a high-efficiency chip cooling solution that can achieve 1,000 watts of cooling capacity, five times the rate of traditional technologies.

Semicon Taiwan is underway. At the invitation of the economics ministry, industry leaders attended the launch of a themed pavilion featuring 52 cutting-edge technologies.

Chiou Chyou-huey
Department of Industrial Technology director-general
Over the past five years or so, we invested a total of NT$25 billion in developing these forward-looking semiconductor technologies.

Presidential Office senior adviser Shen Jong-chin attended the grand opening and hailed Taiwan for its world-leading chip sector. The pavilion features a hybrid atomic layer deposition technology for sub-2-nanometer processes. As chips get smaller and more sophisticated, deposition technology must become increasingly precise and uniform. This latest technology can perform plasma spray and thermal spray coatings in the same chamber, enhancing efficiency.

Wang Chun-hui
Asahi-Utou Technology head
We hope to drive growth in the domestic semiconductor machinery and equipment industry, to promote it more overseas. We also want to raise the self-sufficiency rate of the domestic chip sector, to make ourselves more self-reliant.

Amid the boom in AI and high-performance computing, demand is surging for servers and data centers, making efficient cooling crucial. Working with the chip sector, the Industrial Technology Research Institute developed a novel heat dissipation technology. It can be attached directly to a chip to speed up heat conduction. While traditional cooling elements can provide 200 watts of cooling capacity, this new technology can achieve 1,000 watts.

Chou Wan-shun
I-chiun Precision head
All AI applications need advanced high-speed chips. As for the heat on these chips, we’ve developed a new product that can be attached directly to the chips for heat dissipation.

By 2030, the global semiconductor industry is projected to be worth US$1 trillion. Taiwan is poised to be a key driver of future growth. With output value surpassing NT$5 trillion last year, Taiwan ranked second in the world, reaffirming its technological strength.

半導體展盛大開幕 經濟部展示52項前瞻技術

2023-09-07

科技界盛事"Semicon Taiwan"半導體展週三盛大開幕,經濟部也在現場展示52項前瞻技術。引人關注的,包含廠商開發的二奈米製程鍍膜設備,獲得全球研發大獎,另外,還有工研院和業者合作,研發高效率散熱元件,比起傳統200瓦,現在能達到1000瓦的效能。

Semicon Taiwan半導體展盛大展開,經濟部邀請合作的產業界代表,出席主題館開幕儀式,展示52項最新技術。

[[經濟部技術處處長 邱求慧]]
“我們過去大概有5年的時間,總共有投入250億元,投入在前瞻的半導體科技研發裡面的這些最新成果。”

總統府資政沈榮津也來參與,大讚台灣半導體技術獨步全球。現場還展示,廠商開發的二奈米以下半導體鍍膜設備,未來晶片做得越來越精細,鍍膜厚度也要更精準、更均勻,還能在同一個腔體,進行電漿或熱鍍膜,提升效率。

[[旭宇騰精密科技董事長 王春暉]]
“也希望能夠推動我們國內半導體自製機器設備,能夠再更往國際推廣,那也提升國內半導體自製率的,自主化也能夠提升。”

AI產業和高效能運算正當紅,但伺服器和建構資料中心時,散熱效能也是關鍵。工研院和企業合作,推出新的散熱技術,直接貼合在晶片上,加快導熱速度。相較於傳統散熱元件只能提供200瓦,新的能達到1000瓦散熱能力。

[[一詮精密工業董事長 周萬順]]
“AI應用這些都需要高級高速的晶片,這些晶片的熱度,現在我們開發這個新的產品,是直接在晶片上面直接散熱。”

根據統計,全球半導體在2030年,能達到破兆美元產值,台灣佔有重要地位,去年產值突破新台幣5兆元,位居全球第二,再次展現我國的科技實力。

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