
Intel CEO Pat Gelsinger is in Taiwan to attend the 2023 Intel Innovation Taipei. It’s his fifth trip to Taiwan since becoming CEO, and his second visit this year. At the event, Intel unveiled its latest hardware designed for advanced AI capabilities. The crowd was a who’s who of Taiwanese tech players, including Acer and ASUS.
On his way to the stage, Intel CEO Pat Gelsinger embraces Wiwynn Chair Emily Hong and has a quick chat with Wiwynn CEO Chang Sun-lai. Also present are ASUS Chair Jonney Shih and Acer Chair Jason Chen. It’s the 2023 Intel Innovation Taipei tech forum.
Pat Gelsinger
Intel CEO
This is a composition of Intel silicon over a UCIe interface and an advanced package combining a TSMC N3E test chip as well, over an EMIB interconnection as well.
Intel worked with TSMC to produce a UCIe interface, which offers a more compact and power-efficient connection between processors and graphics cards. Gelsinger has clearly prioritized the Taiwan supply chain, having visited Taiwan five times since becoming Intel CEO. This year alone, he’s visited twice.
Yeh Wei-hsiang
FTV reporter
In the past, Intel had only held smaller innovation events in Taiwan. But this year, its Innovation Day is quite large. The computer giant has 31 partners, 28 of which are Taiwanese. Its fastest CPU yet is expected to hit the market next year.
At the event, the company showcased its high-end processors, designed for demanding tasks such as artificial intelligence. The technology can render 2D images into 3D and features vast improvements in heat dissipation, from the previous 500 watts to 1,500 watts. Gelsinger says Intel’s 20A and 18A chips, comparable to TSMC’s 2- and 1.8- nanometer chips, may be unveiled as early as next year.
Pat Gelsinger
Intel CEO
18A, No. 5 of the five nodes in four years. So this to me is sort of the finish of this incredible march that we set ourselves on, this path to delivering the next generation in scale.
Intel showed off its latest technologies at the event, which was held in the homeland of TSMC and other chip giants. With a semiconductor war raging, tech firms around the world are coming together to push the sector’s limits.
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處理器大廠英特爾一直以來和台積電的關係微妙!執行長基辛格上任以來,五度來到台灣,今年更將亞太日本區唯一的實體活動辦在台灣,今天"2023英特爾創新日"盛大登場,基辛格更在一開場就擁抱宏碁、華碩和緯穎董座,現場歡欣鼓舞。
特地走到台前,看到緯穎董事長洪麗甯,直接來個大擁抱,和緯穎總座張順來在一旁有說有笑,不只他們,華碩董座施崇棠、宏碁董座陳俊聖也都到場,英特爾執行長基辛格來勢洶洶,為2023英特爾創新日揭開序幕。
[[英特爾執行長 基辛格]]
“這一個英特爾的晶片組合,包括UCIe聯盟,結合台積電的三奈米測試晶片,還有EMIB封裝結構”
攜手台積電組成UCIe聯盟,強調晶片會越做越小、耗電更少,目標串聯處理器和顯卡,CEO基辛格高度重視台灣供應鏈,光是上任以來,已經到台灣五次,今天更是今年第二度訪台。
[[民視記者 葉為襄]]
“過去在台灣只有舉辦小型的創新日,而今年是罕見在台灣,舉辦大型的Innovation Day,在31家合作夥伴裡頭,有28家來自台灣,未來世代的CPU最快明年問世”
現場展現高運算處理器,積極布局AI,還有能透過運算讓2D變成3D技術、散熱功能更是大大提升,從以往的500瓦,現在提升到1500瓦,以20A和18A相當於2奈米和1.8奈米晶圓最快明年就會亮相。
[[英特爾執行長 基辛格]]
“第五個18A晶圓,4年5節點製程,這對我來說是完成一個很難以置信的里程碑,這條路將引領我們邁向下一代的擴展規模”
英特爾趁著創新日,把最好的技術通通拿出來,來到護國神山台積電的發跡地,矽晶圓戰爭如火如荼展開。
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