
TSMC delivered another stellar performance in the third quarter, with revenue up 50% year-on-year and earnings per share hitting a record NT$29.43. CEO C.C. Wei emphasized that surging AI demand has the company racing to expand capacity and develop advanced packaging technologies. Last week, reports emerged that TSMC was considering building a factory in Texas, amid claims from Tesla CEO Elon Musk that discussions were underway. Wei addressed the speculation for the first time at the company’s latest earnings conference. Let’s hear more.
Voice of C.C. Wei
TSMC CEO
The demand is extremely robust, getting higher and higher. We look at it from every angle. [We do our own] one more step to check the data center build-out. [Demand is] higher than the supply, and we are working very hard to narrow the gap. [We did] expand our capacities’ consideration to see outside Arizona. We sent the teams to Texas to do all the evaluation. We also talked to one of our customers who’s trying to build a fab, Terafab [and] see whether we can be utilizing that actual capacity. We are still in discussions. The fab has got to be run by TSMC.
Voice of Wendell Huang
TSMC CFO
[Our CapEx] from 2026 to 2028 is expected to be significantly higher than the past three years. We have no intention to leave any food on the table for others.
TSMC has set its full-year capital expenditure budget between US$60 billion and US$64 billion. The company remains a leader in wafer manufacturing to mass production of advanced packaging at the 5-inch size. It is also developing larger formats and advancing its CoPoS technology, aiming to keep a firm grip on any growing business opportunities that come up.
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台積電第三季再度繳出亮眼成績,營收年增五成,EPS來到29.43元新高。董事長魏哲家強調,AI需求強,正努力追趕產能,開發先進封裝技術。上週又傳出評估在德州建廠,特斯拉執行長馬斯克尋求合作的傳聞,魏哲家在法說會上首度回應。
[[聲源: 台積電董事長 魏哲家]]
“需求極為強勁,而且越來越高。我們從各角度去檢視,進一步去確認資料中心建置情形,(晶片)需求仍高於供給,我們正非常努力縮短缺口差距。我們有在亞利桑那以外的地方進行擴產評估,派了團隊前往德州評估,我們也與其中一位客人談,他們嘗試蓋晶圓廠,超級晶圓廠,看看是否能利用額外產能。目前仍在討論階段,晶圓廠必須由台積電營運。”
[[聲源: 台積電財務長 黃仁昭]]
“(資本支出)從2026到2028年,預期會顯著地高於過去3年。我們無意把機會留給他人。”
台積電全年資本支出預算600億到640億美元。從晶圓製造,到5吋光罩尺寸的先進封裝量產,無人能敵,也正開發更大尺寸,並推進CoPoS技術,台積電要把商機,緊緊握在手中。
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